FANTOM PROJECT : Electronic Speckle Pattern Interferometry at Thermal Infrared Wavelengths, A New Technique for Combining Temperature and Displacement Measurements

We present a novel technique which suitably combines thermographic and displacement full-field measurement by performing electronic speckle pattern interferometry at thermal infrared wavelengths, associating CO2 lasers with microbolometer thermal imagers. Application in observing thermomechanical behaviour of composite structures is presented.