Study on Al/Mg compound materials by solid- liquid bonding method

Al/Mg compound materials were fabricated by a solid–liquid bonding method. The well bonded interface with a transition layer can be obtained. There were two kinds of interface structures in the ingot. The microstructures and bonding properties of Al/Mg interface were studied. The results showed that the brittle interface layer was composed mainly of intermetallic compound Al12Mg17 and Al3Mg2 at the top part and Al3Mg2 at the bottom part of ingot respectively. The reason why two kinds of interface structures existed was explained.