Method for manufacture of semiconductor package

The present invention is a semiconductor package comprising: placing the outer lead and the inner lead of the semiconductor chip mounting formed by bending upward therefrom in each of the lower die and the molding container; On top of the tape and then placing the upper mold and; The step of clamping the mold and the top surface of the tape outer leads to be brought into close contact with; Wherein the injection of the molten molding compound into each mold container and cured to form a package body; Comprises including the step of removing the mold and the tape from the package body, the semiconductor packages prepared as described above has the effect of preventing a flash caused by molding compound on the top surface of the outer lead exposed after the molding process, Further, the outer leads are individually protruded on the upper surface of the package body is effective is nophi the reliability of the solder joints during mounting the printed circuit board.