Electronic device, substrate, and method for manufacturing electronic device

Provided is an electronic device which has excellent electrical characteristics and can be efficiently manufactured. An electronic device (10) is provided with: an electronic element (11) having a sensitive area (11a) and an electrode (11b) formed on the main surface; a substrate (12) having a wiring pattern (12a) formed on the wiring surface; and a wall section (13) formed of two or more members. The electrode (11b) and the wiring pattern (12b) are electrically connected with a bump (14) therebetween, and a connecting section (15) is formed. The electronic element (11) is mounted on the substrate (12) at a fixed distance, and since a wall section (13) is formed on the outer circumferential region of a wiring surface region that corresponds to the sensitive area (11a) on the substrate (12), the space between the main surface and the wiring surface is partitioned into an inner space (17) that corresponds to the sensitive area (11a) and the outer space (18) outside of the inner space. The connecting section (15) is sealed by means of an insulating resin (16), and there is substantially no insulating resin (16) in the inner space (17).