Latest Progress in Power Modules for Appliance Inverter Applications

This paper presents a new version of the Dual In-line Package Intelligent Power Module (DIP-IPM Ver. 4) developed by Mitsubishi Electric for home appliance motor control. The DIP-IPM Ver. 4, features a completely lead free process with both chip bonding solders and lead plating compliant with international initiatives for the reduction of hazardous materials. Package miniaturization has been achieved by utilizing a new insulating resin sheet with high thermal conductivity, direct wire bonding technology, and an optimized lead frame design.