Light emitting diode (LED) packaging structure capable of enhancing light emitting efficiency

The utility model relates to a light emitting diode (LED) packaging structure capable of enhancing the light emitting efficiency, which comprises a base, a light reflecting cup bracket which is arranged on the base and is also provided with an inwards concave space, at least one LED chip, a first fluorescent powder layer and a second fluorescent powder layer. The LED chip is reversedly arranged on a silicon substrate, and the silicon substrate is arranged in the inwards concave space of the light reflecting cup bracket. The first fluorescent powder layer is arranged above a light emitting area of the LED chip, the second fluorescent powder layer is arranged at the upper surface of the first fluorescent powder layer, and the wavelength of the color section of the first fluorescent powder layer is greater than the wavelength of the color section of the second fluorescent powder layer. Relative to the prior art, the LED packaging structure disclosed by the utility model is beneficial to enhancing the external quantum efficiency of the LED chip so as to enhance the light emitting efficiency of the LED packaging structure.