Novel Technology Options for Multilayer-Based Ceramic Microsystems

Ceramic multilayer technologies such as LTCC (low temperature cofired ceramics) or HTCC (high temperature cofired ceramics) are applied for the fabrication of highly integrated ceramic microelectronic packages. Furthermore, ceramic multilayer technologies offer the possibility of additionally integrating 3D structures for multilayer-based microsystems. This paper presents a new machine for tape/multilayer structuring that combines micro punching tools and micro UV-laser ablation/cutting. The application for the production of different multilayer-based components is described (e.g., LTCC-based PEM fuel cell system, LTCC-based pressure sensors). Aerosol jet printing is a new technology, for example, for rapid prototyping for LTCC multilayer and 3D deposition of functional layers on LTCC. Advantages and limitations of the technology are discussed.