For semiconductor encapsulation silicone composition

The semiconductor encapsulating silicone composition, (A) (a1) at least the The amount to be 3.0 mol, and wherein a decrease (C) containing platinum catalyst, the storage modulus of the cured product over 40% 50 ° C. from 25 ° C.. Forming a cured product having moderate elasticity, and capable significant reduction in the elastic modulus of the cured product by heating.