A method for mounting semiconductor chips, and apparatus for transferring semiconductor chips

The invention relates to a method of mounting semiconductor chip in which first of all the semiconductor chips are transferred from a first carrier to a transfer unit. The transfer unit in this case has a receiving area. The transfer of the semiconductor chip from the first carrier to the transfer unit is effected by a rolling of the receiving portion of the transfer unit on the first carrier. In a further method step, the picked up by the transfer unit semiconductor chips are transported from the receiving area to a discharge area of ​​the transfer unit. In a subsequent process step, the semiconductor chips from the transfer unit is transferred to a second carrier. Transferring the semiconductor chips from the transfer unit to the second carrier is performed by a rolling of the discharge region of the transfer unit on the second carrier.