Hot-melt silicone and curing hot-melt composition

More than 10 mole% of (A) total silicon-bonded organic groups and organopolysiloxane least two containing silicon-bonded hydrogen atoms in the alkenyl group-containing organopolysiloxane and (B) one molecule are phenyl groups, (C) in the presence of a hydrosilylation catalyst, made by hydrosilylation reaction, non-flowable at 25 ° C., hot-melt silicone melt viscosity of 100 ° C. is not more than 5,000 Pa · s, and (I) the hot-melt silicone, (II) a silicon-bonded hydrogen atoms and at least two contained in one molecule, organopolysiloxane silicon-bonded hydrogen atoms is at least 0.5 wt%, and (III) a hydrosilylation reaction at least comprising curing hot melt composition from use catalysts. The hot-melt silicone is a non-flowable at 25 ° C., the surface tackiness is low, easily melted by heating. Further, the curable hot melt composition having both a curable hot-melt properties.