Electromechanical impedance based debond localisation in a composite sandwich structure

Shirsendu Sikdar,Shishir Kumar Singh,Pawel Malinowski,Wieslaw Ostachowicz

Electromechanical impedance based debond localisation in a composite sandwich structure

2021

Shirsendu Sikdar
Shishir Kumar Singh
Pawel Malinowski
Wieslaw Ostachowicz

An electromechanical impedance (EMI) based structural health monitoring (SHM) approach is proposed for the localisation of skin-core debonds in composite sandwich structure (CSS). Towards this, lab...

Keywords:

Materials science
electromechanical impedance
Composite material
EMI
Composite number
Piezoelectricity
Structural health monitoring

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