Study on LD-pumped Nd : YAG laser cutter - art. no. 60282F

The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting, while it is also unperfected with ecumenical laser cutter without good beam quality or precise lasero when the cutting velocity equals 100mm/min, double-layer 0.75mm thick silicon wafer can be penetrated.. The cross section is fine and the groove is narrow, the cutting quality meets the expecting demand.