3D integrated eWLB /FO-WLP technology for PoP & SiP

The trends for smartphone and other mobile devices are more than ever for integration and lower cost. Meanwhile, a higher degree of functionality and performance, thinner profile, and longer battery life are some of the additional market drivers seen in these devices. The implications of these market drivers on the packaging content of mobile devices including internet of things (IoT) and wearable electronics (WE) are; higher performance designs, lower power consumption, lower cost, smaller form factor, thinner profile and higher level of integration.