Application of Soldering Tips on Ceramics/Metal Composite

Recently, the use of Pb-free solder has caused early deterioration and decreased lifetime of the soldering iron tip. Therefore, it is critical to find a solution to this problem. In this study, the changes in the properties of a ceramics/metal composite (Al2O3/Ni) were investigated. The resistance of solder erosion and thermal conductivity were also investigated in the composites. The possibility of using that composite as the soldering iron tip was considered. The ceramics/metal composite did not have the anisotropic mechanical properties and solder wettability, while those properties did not vary with changes in the pressure area of HP sintering. The test temperatures (503 K and 623 K) and environments (air and N2 gas) also did not influence those properties of the composite. The changes in those properties of an Al2O3/Ni composite were caused by the generation of columnar or equi-axied grains with the addition of Ni and by changes in the relative density and the surface energy. Although the thermal conductivity was lower in the Al2O3/Ni composite compared with Cu, erosion by molten solder could be controlled in the composite.