Direct activation of copper electroplating on conductive composite of polythiophene surface-coated with nickel nanoparticles

Abstract In this work, a novel method involving conductive polymer and nanoparticles for copper electroplating on insulating substrate is proposed. Nickel nanoparticles introduced into the network of polythiophene (PT) to form PT-based composite are confirmed to be the essential prerequisite to initiate copper electroplating. It thus realizes the direct metal electroplating on conductive polymers-based composite. Multiple characterizations are conducted to confirm that the nickel nanoparticles act as metal crystal nucleus for copper deposition during the electroplating. The electroplating rate and peel strength are systematically examined to evaluate the practical performances of as-obtained copper on PT-based composite. Experimental results show that the conductive composite of PT surface-coated with nickel nanoparticles (NiNPs) mediated copper layer holds excellent adhesion property in comparison with the one generated through conventional metal deposition method.