Adhesive composition for semiconductor, adhesive film comprising the same

PURPOSE: An adhesive composition for semiconductor and an adhesive film including the same are provided to reduce or omit semi-cure process and to remove or minimize foamable void. CONSTITUTION: An adhesive composition for semiconductor has a compressive strength of 100-150 gf/mm^2 at 125 deg. Celsius after curing for 60 minutes and compressive strength of 500-1000 gf/mm^2 at 150 deg. Celsius after curing for 10 minutes, at 150 deg. Celsius after curing for 30 minutes, and at 175 deg. Celsius after mold 60 seconds, and the void thereof are all less than 10%. The adhesive compound comprises a thermoplastic resin, an epoxy resin, a hardener, and a curing catalyst. 30-70 weight% of the thermoplastic resin is included based on whole composition. The thermoplastic resin content amount is bigger than sum total of the epoxy resin and the hardener.