Fabrication of Superhydrophobic Hierarchical Surfaces by Square Pulse Electrodeposition: Copper‐Based Layers on Gold/Silicon (100) Substrates

: Copper based layers were fabricated on gold/silicon (100) substrates by using square pulse electrodeposition at different deposition temperatures. The predominant crystalline plane on Cu2 O samples at temperatures higher than 30 °C is (111), which is the most hydrophobic facet of Cu2 O cubic structure. Different crystallite structures such as semivertical leaves, fractal trees, and octahedral pyramids were formed on the surface. These water-repellent samples have hierarchical structures, including octahedral pyramid microstructures with small spherical balls on them and well-branched micrometric vertical leaves on the surface. They provide a suitable surface for trapping air pockets inside the structure and increasing the water contact angle up to 154°. This approach may be applicable to the large-scale preparation of water-repellent surfaces as superhydrophobicity can be achieved in a one-step deposition process without any secondary modifications.