LED package and manufacturing method thereof

The invention relates to an LED package manufacturing method which comprises the following steps: forming a conductive line layer on a substrate; forming a non-transparent wall layer on the conductive line layer in a screen printing manner, wherein the wall layer is grid-shaped for forming a plurality of wall units so that the conductive line layer in the area which is surrounded by the wall unit is exposed; fixing and electrically connecting at least one LED crystal grain in the conductive line layer in each wall unit; forming a light-penetrable glue layer in a molding forming manner, wherein the transparent glue layer covers the LED crystal gain which is arranged on the conductive line layer; and cutting for forming a plurality of LED packages corresponding to each wall unit. The wall layer is formed on the substrate in the screen printing manner. After crystal is fixed, only one-time molding forming is required and secondary cutting is not required. Problems of interface adhesion and stripping between the light-penetrable glue layer and the wall layer caused by cutting the edge are settled.