Power module means and power conversion device

The invention provides a line converting apparatus having a housing that: contain the alternating arrangement of cooling devices and semiconductor components, the semiconductor elements, allows to cool the semiconductor elements of the two surfaces; exerts pressure on the alternately arranged cooling devices and semiconductor components, and can be designed to be less stiff in the direction of pressure application in order to avoid gaps; and which can be sealed, so that a leaking is prevented even during the injection of liquid silicone gel. The power converting apparatus is provided with a housing, the edges of which lie substantially in the same plane and having a mold with depressions, the number of which is as large as the number of mounted semiconductor devices each having a semiconductor element and a terminal. The semiconductor components are arranged at positions corresponding to the recesses of the housing. The cooling devices are arranged so that the semiconductor components are arranged with the housing in each case between them. And the semiconductor components are sealed with a silicone gel.