Interface bonding performance of CuW alloy coating on Cu substrate

In this paper, CuW alloy is successfully coated on copper substrate by microwave sintering. A wedged load test and scanning electronic microscopy (SEM) are employed to investigate the interface bonding performance. The results show that the CuW coating bonds firmly to the copper substrate without any gap or crack. The interface bonding strength increases with the temperature increase, but doesn't show an obvious regularity changing with holding time increase.