Electroless copper contacts for low concentration silicon solar cells

The purpose of this work was to form highly conductive and low cost copper contacts on shallow and hence optically thin p-n junctions (<0.4μm deep) on a randomly textured solar cells for low concentration PV (LCPV) module. At first, window formation process in SiNx by femtosecond UV laser pulse ablation on the textured surface was introduced. Then nickel silicide contacts were formed and subsequent contact thickening was performed by electroless copper plating in an industrially feasible way. Characteristics of finished solar cells were investigated in this work. The cells were successfully implemented into the low concentration (C=15x) PV module.