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次世代三次元積層半導体用 Ag/Sn系多層薄膜電極間接合に関する研究
次世代三次元積層半導体用 Ag/Sn系多層薄膜電極間接合に関する研究
2014
yoneda seizin
satou ryouhei
iwata tuyosi ya
sigemoto takumi
atumi kouitirou
okamoto kazuya
hirata yosinori
Keywords:
Anodic bonding
Materials science
Metallurgy
Inorganic chemistry
Bonding in solids
surface oxidation
Through-silicon via
Correction
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