Microstructural characteristics and electrical resistivity of rapidly solidified Co-Sn alloys

The rapid solidification behavior of Co-Sn alloys was investigated by melt spinning method.The growth morphology of αCo phase in Co-20% Sn hypoeutectic alloy changes senistively with cooling rate.A layer of columnar αCo dendrite forms near the roller side at low colling rates.This region becomes small and disappears as the cooling rate increases and a kind of very fine homogeneous microstructure characterized by the distribution of equiaxed αCo dendrites in γCo3Sn matrix is subsequently produced.For Co-34.2% Sn eutectic alloy,anomalous eutectic forms within the whole range of cooling rates.The increase of cooling rate has two obvious effects on both alloys:one is the microstructure refinement,and the other is that it produces more crystal defects to intensify the seattering of free electrons,leading to a remarkable increase of electrical resistivity,Under the condition that the grain boundary reflection coefficient γ approaches 1,the resistivity of rapidly solidified Co-Sn alloys can be predicted theoretically.