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(Invited) PE-TEOS Wafer Bonding Enhancement at Low Temperature with a High-k Dielectric Capping Layer
(Invited) PE-TEOS Wafer Bonding Enhancement at Low Temperature with a High-k Dielectric Capping Layer
2010
Chuan Seng Tan
Gang Yih Chong
Keywords:
High-κ dielectric
Wafer bonding
Ceramic materials
Materials science
Composite material
Dielectric
Correction
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