Tape wiring board, chip-on-film and package assembly

The present invention is a tape circuit board, a chip with an insulating film substrate, relates to a film package and assembly -one. On-chip, according to an embodiment of the invention the film package, having a first main surface and a second major surface having at least one chip mounting area, at least one via extending through between the second main surface and the first main surface an insulating film substrate comprising; Wherein the at least one provided on the first main surface of the plurality of first metal pattern layer is provided on and the second main surface is electrically connected to the at least one of the plurality of first metal pattern layer by the via the the second metal layer pattern; And it is mounted on the chip mounting area and may include a plurality of electrode pads formed on the bottom surface perimeter. The plurality of electrode pads are respectively bonded to at least one of the plurality of first metal pattern layer is formed by the conductive bumps.