Two-sided adhesive tape for semiconductor processing and tape for semiconductor processing

The present invention provides a semiconductor processing double-faced adhesive tape that is used to bond the semiconductor wafer and the support plate for the manufacture of IC chips to reinforce the semiconductor wafer, between easily and reliably semiconductor processing double-faced adhesive tape and the support plate by providing incentives for its object to provide a semiconductor processing of the double-faced adhesive tape being able to be taken off. The present invention comprises a semiconductor processing double-faced adhesive tape that is used to bond the semiconductor wafer and the support plate for the manufacture of IC chips to reinforce the semiconductor wafer, the pressure-sensitive adhesive layer formed on both surfaces of the base material and the base material, the support plate and the pressure-sensitive adhesive layer on the side to be bonded, intended to contain a gas generating agent that generates a gas by a magnetic pole, and has been subjected to the support plate and the release process of a dot shape on the base material on the side in contact with the pressure-sensitive adhesive layer on the side to be bonded, the diameter of the dot subjected to the release treatment when the number of dots per x, 1 ㎠ to y, is within a range of double-faced adhesive tape for processing semiconductor x and y is enclosed by the broken line a, dashed line B and the broken line C of FIG.