Old Web
English
Sign In
Acemap
>
Paper
>
Micro-Friction and Adhesion Measurements for Si Wafer and TiB2 Thin Film
Micro-Friction and Adhesion Measurements for Si Wafer and TiB2 Thin Film
2007
qingtao
Tianmin Shao
Shizhu Wen
Keywords:
Thin film
Wafer
Composite material
Adhesion
Materials science
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]