Wafer-level packaging method for image sensor

The invention discloses a wafer-level packaging method for an image sensor. In the process of packaging an image sensor chip at a wafer level, double-sided cutting is carried out on a packaged wafer packaging structure at first, a single image sensor is formed by separation with the help of a penetrating cutting slot, and a packaging cover plate of the single image sensor is enabled to reserve a small part of adhesion with a supporting cofferdam; and then the cover plate is separated by adopting a mode of external force applying, heating or laser irradiation. Therefore, the packaging cover plate of the single image sensor reserves a small part of adhesion with the supporting cofferdam, so that the bonding area of the packaging cover plate and the supporting cofferdam is effectively reduced, thereby being capable of weakening binding power between the packaging cover plate and the supporting cofferdam, being capable of separating the packaging cover plate and the image sensor very conveniently, and causing no damages for the image sensor.