Structure and Mechanical Properties of Nanostructured Metal-Carbon Films

Nanocrystalline copper/hydrogenated amorphous carbon (nc-Cu/a-C:H) films have been deposited on Si substrates by a microwave plasma-enhanced chemical vapor deposition process combined with a sputter deposition process. The deposition rate of films was found to vary in the range of 15 to 25 nm/min depending on the composition of argonmethane mixtures. These films were analyzed by Rutherford backscattering spectroscopy and Raman spectroscopy. The crystallographic structure, nanohardness, and friction coefficient of films were investigated as functions of the carbon content.