Seamless high off-chip connectivity [IC packaging]

Seamless high off-chip connectivity (SHOCC) is a combined packaging, interconnect, and IC design philosophy based on a wire hierarchy distributed between the active die and a passive interconnection substrate. SHOCC takes a system level view of the chip, package and substrate requirements to shift the device fabrication paradigm from the current single die approach to a parallel manufacturing scheme which is expected to provide a system with better performance and lower cost. The SHOCC Consortium is conducting a coordinated technology research and development project to assess the potential value of SHOCC, define and develop the process technologies and materials needed to implement SHOCC, and demonstrate the value of SHOCC in real parts and systems. This paper describes the SHOCC concept and details the current status of the technology.