Chip-on-film package and device assembly including the same

The present invention relates to a device assembly comprising a package and this chip-on film. Chip-on film package assembly according to the invention comprises a plurality of film through the film substrate wirings are formed; A plurality of panels through hole is formed includes a panel substrate, and the chip is placed on top of the film on the package that the one chip on one end portion of the film package are electrically coupled to the panel; And one containing the chip on the other end electrically connected to the control unit of the film package is placed on the bottom panel portion.