Эволюция рельефа поверхности тонких диэлектрических пленок при термическом отжиге. Фрактальный анализ

Surface morphology evolution of thin dielectric films during annealing is studied by atomic-force microscopy. It has been found that, regardless of the film-deposition temperature, annealing at temperatures up to 400 °С does not result in considerable changes of film surface relief. Increasing the annealing temperature up to 600 °С leads to formation of local hillocks and dimples on the film surfaces. The fractal analysis is employed to estimate quantitatively changes of the surface relief. The processes developed into the bulk of the films during annealing are discussed based on data from atomic-force microscopy, reflection electron diffraction analysis, and secondary ion mass spectroscopy.