Enhanced thermal and mechanical properties of epoxy composites filled with silver nanowires and nanoparticles

Abstract High thermal conductivity films were prepared by blending silver nanowires (AgNws) with epoxy resins. 3-Aminopropyltriethoxysilane (APTES) silane was used to modify the AgNws surface, to produce a high aspect ratio and high thermal conductivity. A thermal interface material with a high thermal conductivity coefficient was used to form a thermal channel in epoxy resins, which possess superior thermal conductivity when the composite contained AgNws higher than 50 phr. The phr ratio of AgNws to silver nanoparticles (AgNps) loading was 50:300 when the thermal conductivity coefficient of the composite reached approximately 8 W/mK. The composite density ratio of AgNws (50 phr) to AgNps (300 phr) was 1.512:3.650 (g/cm 3 ), which suggests that the density can be reduced by more than 50% in weight when AgNws, rather than AgNps, were used to prepare thermal interface composites. Furthermore, the adhesion test indicates that the composite containing a lower loading of AgNws exhibits higher adhesive property than that of the composite containing a higher loading of AgNps with a similar thermal conductivity coefficient, thereby resulting in enhanced adhesiveness between devices.