Method of making an article having a surface having irregularities

The present invention improves the method for forming irregularities by utilizing a difference in etching rate, to relax the restrictions on the substrate in this way. In the method of the present invention, the step of applying pressure to a predetermined area of ​​the surface of the thin film formed on a substrate, the region including at least a portion of the remainder of the surface except at least a part and said predetermined area of ​​said predetermined area by a method comprising a step of etching to form a textured surface. To utilize the difference in the etching rate in the thin film, flexibility in selection of the substrate material is increased.