Photographing module group and molded circuit board component and manufacturing method thereof and electronic equipment having photographing module group

The invention provides a photographing module group and a molded circuit board component and a manufacturing method thereof and electronic equipment having the photographing module group. The molded circuit board component comprises a molded base and at least one circuit board. The circuit board comprises at least one substrate and at least one connecting plate. The connecting plate is connected on the substrate. The substrate is used for conducting at least one light sensitive chip. The molded base is at least integrally combined on the substrate so that the light sensitive chip is enabled tobe corresponding to the light window of the molded base.