Development of an Ultraprecision Grinding Equipment for Ductile Node Surface Finishing of Brittle Materials

Ductile mode ultraprecision grinding technology Is highly expected as a next-stage machining process of semiconductor materials. For industrially realizing this technology, We have developed an ultraprecision surface grinding equipment. This equipment is composed of ultraprecision systems such as force-operated linear actuator, composite bearing guideway mechanism, load compensation unit, spindle fixed wheel driving unit and so on. By these systems, inching resolusion of the grinding wheel head reached lOnm, and the loop stiffness between the grinding wheel and the working table was 150 N/μm. SAM observations revealed that no cracks were remaining under ground surface. The thickness of dislocation layer remained on the ground silicon wafers is not more than 0.5/μm. The flatness TTV of 6″ silicon plate ground by this equipment was under 0.6μm.