A needle assembly for lifting a chip from a carrier material

The present application relates to a needle assembly for lifting a chip from a substrate, wherein the chip has a square-shaped first surface, and because projecting followed by a square-shaped second surface on one of the sides of the square-shaped first surface, wherein the side of the second surface with which this adjoins the side of the first surface is substantially shorter than the side of the first surface, characterized in that the needle assembly is arranged such that a first needle in the first surface when lifting of the chip attaches and at least a second needle in the second face of chips attaches to prevent quenching of the first surface from the second surface at lift-off of the chip.