Micro-strip interdigital circuit board for microwave non-thermal effect research

The invention provides a micro-strip interdigital circuit board for microwave non-thermal effect research, and belongs to the crossing field of microwave technology and chemical technology. The micro-strip interdigital circuit board is composed of a micro-strip interdigital circuit layer (I), a dielectric layer (II) and a metal ground layer (III), wherein the micro-strip interdigital circuit layer (I) is composed of a left feed part, a right feed part, a left impedance conversion branchknot, a right impedance conversion branchknot, left micro-strip fingers and right micro-strip fingers, the dielectric layer (II) is made of polytetrafluoroethylene, and a metal layer is coated on the metal ground layer (III). The micro-strip interdigital circuit board for the microwave non-thermal effect research is characterized in that two ends of the left feed part and the right feed part are similar in forms of wrists, the left impedance conversion branchknot and the right impedance conversion branchknot are similar in forms of palms, the middle portion of the left micro-strip fingers and the right micro-strip fingers are similar in forms of fingers, the left feed part is connected with the left impedance conversion branchknot, and the right feed part is connected with the right impedance conversion branchknot. The micro-strip fingers are the same in length and width, gaps between every two fingers are the same, gaps between left finger roots and right finger tips and gaps between left finger tips and right finger roots are the same, and corners of micro-strip transmission lines are all made into circular arc structures. The micro-strip interdigital circuit board for the microwave non-thermal effect research has the advantages of being simple and convenient to manufacture, low in cost, larger in generated electric field intensity compared with electric field intensity obtained through other methods in the same power.