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ENCAPSULATING MATERIAL DESIGN OF EPOXY MOLDING COMPOUNDS FOR HIGH RELIABILITY SEMICONDUCTOR PACKAGING
ENCAPSULATING MATERIAL DESIGN OF EPOXY MOLDING COMPOUNDS FOR HIGH RELIABILITY SEMICONDUCTOR PACKAGING
1996
Akira Nagai
Shuji Eguchi
Toshiaki Ishii
Masatsugu Ogata
Kunihiko Nishi
Keywords:
Polymer chemistry
Materials science
Epoxy
Material Design
Composite material
Molding (process)
Integrated circuit packaging
Correction
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