A wiring board, method of manufacturing a wiring board, and the via paste

Disclosed is a wiring substrate that has: a plurality of wiring disposed with insulating resin layers therebetween; and a via hole conductor that electrically connects the plurality of wiring. The via hole conductor contains a metal portion and a resin portion. The metal portion contains: a region comprising copper particles; a first metal region having as the primary component tin, a tin-copper alloy, or a tin-copper intermetallic compound; and a second metal region having bismuth as the primary component. Cu/Sn is 1.59-21.43. The copper particles electrically connect the plurality of wiring by contacting each other, and at least a portion of the first metal region covers the periphery of the portions at which the copper particles contact each other.