Self-stressing test structures used for high-frequency electromigration

We demonstrate for the first time high frequency (500 mhz) electromigration at the wafer-level using on-chip, self-stressing test structures. Since the stress temperature, frequency, duty cycle and current are controlled by DC signals in these structures, we used conventional DC test equipment without any special modifications (such as high frequency cabling, high temperature probe cards, etc.). This structure significantly reduces the cost of performing realistic high frequency electromigration experiments.