Technological process of ultraviolet laser cutting flexible printed circuit board

A technological method for cutting a flexible printed circuit board by ultraviolet laser is characterized in that ultraviolet laser with output wavelength less than 0.4 microns is used for cutting the flexible printed circuit board. The FPC processed by the method has thin cutting joint, smooth cutting surface, no burr, fast speed and little deformation of materials; the product is ensured not to be scuffed and is manufactured without any die, and materials are saved. By utilizing the method, a cutting thickness can reach 1 mm, the cutting result is precise, a side wall is steep, and the comprehensive precision is within plus or minus 20 microns or more; the round orifices processed by the method can not laminate because of thermal effect, the boring speed is high, and the boring quality is good, and functions of direct shaping, anti-corrosion, solder resistance, and the like are achieved. The method is suitable for processing of fine pattern, especially for the fast development of new products.