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Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
2012
Costello
Strusevich
Flynn
Kay
Patel
Bailey
Price
Bennet
Jones
Desmulliez
Keywords:
Microfluidics
Copper
Chemical engineering
Fluid dynamics
Materials science
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