LED package structure

The invention discloses an LED package structure, which comprises a substrate, an electrode layer, an insulating layer, at least one light-emitting unit and a reflective housing. The electrode layer and the insulating layer are arranged on the substrate and are complementary in shape. The reflective housing is integrally formed with the insulating layer. The light-emitting unit comprises an LED chip and a fluorescent colloid encapsulating the LED chip, the LED chip is mounted on the electrode layer and the insulating layer, the fluorescent colloid is spaced apart from the electrode layer, and a gap ranging from 3 to 10 microns is formed between the fluorescent colloid and the electrode layer. The reflective housing is arranged on the electrode layer and the insulating layer and is further filled in the gap. The reflective housing coats the side edges of the light-emitting unit, the reflective housing and the light-emitting unit each as a top plane arranged away from the substrate, the top plane of the reflective housing is lower than or equal to the top plane of the light-emitting unit, and a distance between the two top planes ranges from 0 to 30 microns. In this way, the problem of poor light shape and brightness of the LED package structure is avoided.