Mems device and method of forming

Micro-electromechanical systems (MEMS) device and method of forming. The MEMS device may include a first substrate located above the MEMS structure. The MEMS structure includes a movable member. Over the first substrate, depositing a first conductive material and the second trench is etched in the substrate. Filling the trenches with a second conductive material and depositing a third conductive material and a second conductive material over the second substrate. Joining the first and second substrates, and the back surface of the second substrate is thinned, thinning of the exposed second conductive material in the trench.