FEASimulation andIn-situ WarpageMonitoring ofLaminated Package MoldedwithGreen EMC UsingShadowMorieSystem

Thewarpage ofindividual ICpanel/package or wholemoldedstrips keepschanging with temperature during theassembly processes from diebonding, wirebonding, molding, post-mold curetosoldering reflow. How tooptimize package design andproperties ofallassembly materials toobtain acceptable warpage level bothat room temperature and reflow temperature becomes morechallenging. Inthis study, Finite element analysis (FEA)simulation wasperformed inwarpage prediction ofthree typesofadvanced laminated IC packages (PBGA,CSPBGA andPoPBGA).Shadow Moriesystem wasusedinmonitoring warpage deviation under temperature profile from-55°C to260°C.Calibration orcorrection ofFEA results canbe performed by introducing experimental results fromShadowMorie measurement tofine-tune themodeling soasto obtain moreaccurate prediction.