Method of manufacturing an electronic apparatus housing and electronics enclosure

PROBLEM TO BE SOLVED: To provide a lightweight electronic equipment housing having high rigidity, good appearance, and high dimensional precision; and to provide a method of manufacturing the electronic equipment housing. SOLUTION: The electronic equipment housing 100 includes: a bottom plate 101 molded by a CFRP made by impregnating a cloth woven by carbon fiber with epoxy resin and by encapsulating the cloth in the epoxy resin; a sidewall 102 of a cast magnesium alloy molded by thixotropic molding; and an adhesive resin 103 integrally molded with the bottom plate 101 and the sidewall 102, and comprising a polyamide resin having a thermoplasticity to mutually bond these bottom plate 101 and the sidewall 102. COPYRIGHT: (C)2010,JPO&INPIT