Texturization control for fabrication of high efficiency mono crystalline si solar cell

We studied the texturization mechanism of mono crystalline silicon wafer using some alternative additives. We successfully controlled the texture size with change of concentration of KOH in the etchant. We also proposed one appropriate model of role of additives in texturization process. In our proposed mechanism, the additives should play a role as micro-mask when the micro pyramid is formed and the texturization process should be dominated by the correlation of etching rate and adhesion and desorption rate of additives. We also fabricated solar cells with several texture sizes and evaluated them. The decrease of F.F. with the decrease of texture size was mainly caused by the increase of Rs and this result suggested that we had to optimize the screen printing and firing conditions for the small texture. In addition, there are thick damaged layer on the top and bottom of texture, and these damaged layer cause the deterioration of cell efficiency with texture miniaturization. Reduction of the damage is important to realize high efficiency solar cell using miniaturized texture.