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Acemap > Paper > OS2-13 Thermal Strain Measurement of Electronic Packaging Structure Using Highly Accurate Digital Image Correlation(Digital image correlation and its applications (4),OS2 Digital image correlation and its applications,MEASUREMENT METHODS)

OS2-13 Thermal Strain Measurement of Electronic Packaging Structure Using Highly Accurate Digital Image Correlation(Digital image correlation and its applications (4),OS2 Digital image correlation and its applications,MEASUREMENT METHODS)

2015 
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