Reliability analysis of lead-free BGA assemblies linking FE simulations and experimental results

Lead-free BGA assemblies are submitted to accelerated ageing test in order to determine the cycle number lead to the failure. The thermo-mechanical simulations are carried out on the assembly model in order to compute the strain energy density dissipated in the solder joints during the thermal cycles. Then the correlation between the experimentations and the simulations allows to predict the cycle number lead to the failure for another test.